Mechanical and Durability Studies about the use of Municipal Solid Waste Landfill in Concrete

Author:

Nair Arya RORCID,B Nirmala DORCID

Abstract

The best way to keep the required format of the manuscript is to overwrite these instructions with its text. Papers should be written in English. Manuscripts s Landfilling is the most common and cheapest method of waste management practice in India. Municipal Solid Waste Landfills (MSWL) became a nuisance affecting the health, hygiene, sanitation and aesthetics of the surrounding area. Aggregates occupy almost 70% of concrete, so replacing waste materials with them could be a rewarding choice. In the current work, an experimental investigation is being carried out to test the addition of MSWL as a substitution with fine aggregate for concrete production. Out of the different aged samples available at the dumpsite, the most aged sample is chosen for experimental investigations according to the basic physical properties. Concrete mixes, with 0%, 4%, 5%, 7% and 10% partial replacement of fine aggregate with MSWL are tested for mechanical properties such as compressive strength, split tensile strength, flexural strength, and non-destructive test and have proved to be a partial substitute for fine aggregate. Durability studies such as water absorption, acid attack and sulphate attack also gave better experimental proof for the sustainable reuse of this waste material. The research reveals 5% replacement is the optimum considering all the test result values. The paper leads to advanced research for the suitability of the material in the construction industry.

Publisher

University of Zielona Góra, Poland

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3