(Sn-Ag)<SUB>eut</SUB> + Cu Soldering Materials, Part II: Electrical and Mechanical Studies-Reference-Cited by-同舟云学术

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(Sn-Ag)_eut + Cu Soldering Materials, Part II: Electrical and Mechanical Studies

Published:2004-04-01 Issue:2 Volume:25 Page:122-124
ISSN:1547-7037
Container-title:Journal of Phase Equilibria & Diffusion
language:en
Short-container-title:Journal of Phase Equilibria & Diffusion

Author:

Kisiel R.,Gasior W.,Moser Z.,Pstruś J.,Bukat K.,Sitek J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Condensed Matter Physics

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication and Implementation of PVA Thin Film-based Relative Humidity Sensor;International Journal of Integrated Engineering;2024-04-29

2. Twin‐Wire Sensor Networks;Advanced Sensor Research;2023-05-05

3. Ag-Cu-Sn Ternary Phase Diagram Evaluation;MSI Eureka;2021-10-20

4. Measurement of Electrical Properties of Sn-Bi-In Alloys;Journal of Electronic Materials;2019-07-29

5. Effect of Graphene Layers on Phenomena Occurring at Interface of Sn-Zn-Cu Solder and Cu Substrate;Journal of Electronic Materials;2017-05-01

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