Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity-Reference-Cited by-同舟云学术

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Published:2021-12-01 Issue:4 Volume:21 Page:3-8
ISSN:1338-3957
Container-title:Acta Electrotechnica et Informatica
language:en
Short-container-title:

Author:

Dzivy Daniel¹,Pietrikova Alena¹,Vrublevskaya Olga²,Shikun Marina A.³

Affiliation:

1. Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics , Technical University of Kosice , Letna 9, 042 00 Kosice, Slovak Republic , Tel. +421 55 602 3010

2. Research Institute for Physical Chemical Problems of the Belarusian State University , Leningradskaya 14 , Minsk , Belarus

3. Belarusian State University , Nezavisimosti avenue 4 , Minsk , Belarus

Abstract

Abstract The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a replacement for the basic accelerated aging test. In this article, various surface finishes are compared by measuring electrical resistivity of solder joints between two soldering pads. The influence of standard surface finishes (ENIG, Lead HASL, Lead-free HASL, Cu, ImSn) with the new developed surface finish based on SnAg7 is also compared. Measurements show that the electrical resistivity is dependent on surface finish type and the thickness of the solder joint. The results prove that the new developed surface finish based on SnAg7 is stable against multiple reflows and comparable to the surface finish based on Au. The new developed surface finish based on SnAg7 can be recommended as a replacement for other conventional surface finishes.

Publisher

Walter de Gruyter GmbH

Subject

General Medicine

Link

https://www.sciendo.com/pdf/10.2478/aei-2021-0001

Reference24 articles.

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2. [2] SIEWIOREK, A.: Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy, Journal of Materials Engineering and Performance, no. 22, pp. 2247–2252, Feb. 2013.

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