Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis-Reference-Cited by-同舟云学术

Design of a CPU Heat Sink with Minichannel-Fins & its Thermal Analysis

Published:2023-09-01 Issue:3 Volume:25 Page:89-100
ISSN:1899-4741
Container-title:Polish Journal of Chemical Technology
language:en
Short-container-title:

Author:

Arzutuğ Mehmet Emin¹

Affiliation:

1. 1 Atatürk University, Engineering Faculty , Chemical Eng. Department , Office UZ117, TR-25100 Erzurum, TÜRKİYE Ener-KA, Ata Teknokent, TR-25240 Erzurum , Türkiye

Abstract

Abstract In this paper, the design and the thermal analysis of a tribled microprocessor cooler combining the advantages of strong swirl flow and minichannel-fins and CuO nanofluid, have been presented. It is thought that the results will contribute to the understanding of the effects of parameters on the cooling flux of the heat sink and the decline at the microprocessor temperature, as Reynolds number in the minichannels and CuO % volume fraction. The results have exhibited that the total performance of the heat sink cooled with the mixture of water–CuO-EG nanofluids increases with the increase of Re number and the %load of nanoparticles in the coolant. It has been determined that the energy withdrawn from the microprocessor was 241 times higher than the energy generated for maximum CuO load and Re number conditions. Besides, the highest temperature decrease has been measured at the maximum CuO load value and maximum Re number.

Publisher

Walter de Gruyter GmbH

Subject

General Chemical Engineering,General Chemistry,Biotechnology

Link

https://www.sciendo.com/pdf/10.2478/pjct-2023-0029

Reference42 articles.

1. Agostini, B., Fabbri, M., Park, J.E., Wojtan, L., Thome, J.R. & Michel, B. (2007). State of The Art of High Heat Flux Cooling Technologies. Heat Transf. Eng. 28(4), 258–281. DOI:10.1080/01457630601117799.

2. Arzutug, M.E. & Basci, A.A. (2021). A New Heat Sink Design for Cooling Microprocessors and Investigation of Cooling Performance, Proceedings, Int. Symposium on Applied Science and Enginnering (Proceedings of ISASE 2021), 7–9 April, 2021 (pp. 120-123) Erzurum, Türkiye.

3. Al-Tae’y, K.A., Ali, E.H. & Jebur, M.N. (2017). Experimental Investigation of Water Cooled Minichannel Heat Sink for Computer Processing Unit Cooling, Int. J. Eng. Res. Appl. 7-8(1), 38–39. DOI: 10.9790/9622-0708013849.

4. Pal, A., Joshi, Y., Beitelmal, M.H., Patel, C.D. & Wenger, T. (2002). Design and Performance Evaluation of a Compact Thermosyphon, IEEE Transactions on Components and Packaking Technologies. 25(4), 601–607. DOI:10.1109/TCAPT.2002.807997.

5. Badruddin, I.A., Al-Rashed, A.A., Salman, A.N.J., Khaleed, H.M.T., Ahmed, N.A., Kamangar, S., Yunus Khan, T.M. (2014). Investigation of Discrete Heating At Upper Section of A Porous Annulus. Aust. J. Basic Appl. Sci. 8(24), 283–289.

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