Affiliation:
1. Belarusian State University of Informatics and Radioelectronics
2. Center for Physical Science and Technology
3. Saint Petersburg Electrotechnical University
Abstract
Introduction. For controlled thermal management of power electronics devices, an important task is to increase the efficiency of heat removal from active components. Aim. To introduce a new approach to placing a linear contact-type heat source on the surface of thin samples in order to study the features of propagation of heat fluxes in oxide substrates from materials with different thermal conductivities. Methods and materials. The paper presents the results of studies of the propagation of heat fluxes in oxide substrates with different thermal conductivity (glassceramic and aluminum oxide ceramic - polycor). To generate the heat flux, a linear heat source was used, for which an electrically conductive carbon fiber was applied. Results. Thermograms and temperature distribution profiles were obtained at different periods of heating time on the surface of the substrate with a heating element and on its reverse side. It was shown that the placement of the linear heat source, implemented using an electrically conductive carbon filament, on the surface of the studied samples and time monitoring of thermograms from two opposite surfaces of the samples allowed to obtain data for evaluating the thermal properties of oxide substrates. The distribution of the heat flux in a homogeneous material near the generation point had the form of a cone of a heat pipe with a base on the surface with a heat source. The thermal cone for an aluminum oxide ceramic substrate had a larger angle of inclination than that in the case of glassceramic. Conclusion. The results obtained allowed to propose a method for reduction of thermal resistance of a heatconducting substrate by creating conditions for increasing the area of heat-conducting section.
Publisher
St. Petersburg Electrotechnical University LETI
Reference20 articles.
1. Yeh L. T. Review of Heat Transfer Technologies in Electronic Equipment. J. Electron. Packag. 1995, vol. 117, iss. 4, pp. 333‒339. doi: 10.1115/1.2792113
2. Simons R. E., An-tonetti V. W., Nakayama W., Oktay S. Heat Transfer in Electronic Packages. Microelectronics Packaging Handbook. Boston, Springer, 1997, pp. 314‒403. doi: 10.1007/978-1-4615-4086-1_4
3. Schelling P. K., Shi Li, Kenneth E. G. Managing heat for electronics // Materials Today, 2005, vol. 8, iss. 6, pp. 30‒35. doi: 10.1016/S1369-7021(05)70935-4
4. Gridnev V. N., Mironova Zh. A., Shakhnov V. A. Ensuring quality of configuration of assembly contact sites of the high density switching payment. J. Reliability and quality of complex systems. 2014, vol. 4, no. 8, pp. 19‒25. (In Russ.)
5. Sementsov S. G., Gridnev V. N., Sergeeva N. A. Infrared thermography methods of assessing temperature effect on reliability of electronic equipment. Bulletin of the Bauman Moscow State Technical University. Instrumentation series. 2016, no. 1, pp. 3‒14. doi: 10.18698/0236-3933-2016-1-3-14/ (In Russ.)