Contact angle between Sn-Ag-Cu solder and electroplated Cu-based Bulk Metallic Glass-Reference-Cited by-同舟云学术

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Contact angle between Sn-Ag-Cu solder and electroplated Cu-based Bulk Metallic Glass

Published:2013 Issue: Volume: Page:553-556
ISSN:
Container-title:Proceedings of the 1st International Joint Symposium on Joining and Welding
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Author:

Nishikawa H.,Naoi T.,Saito M.,Mizuno J.,Fukuhara M.

Publisher

Elsevier

Reference12 articles.

1. Stabilization of metallic supercooled liquid and bulk amorphous alloys;Inoue;Acta. Mater.,2000

2. Bulk amorphous and nanocrystalline alloys with high functional properties;Inoue;Mater. Sci. Eng. A,2001

3. Electron-beam welding of Zr-based bulk metallic glasses;Kagao;Mater. Sci. Eng. A,2004

4. Laser welding Zr45Cu48Al7 bulk glassy alloy;Li;J. Alloys Compd,2006

5. Liquid phase and supercooled liquid phase welding of bulk metallic glasses;Kawamura;Mater. Sci. Eng. A,2004

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1. Soldering Zr metallic glass to Ti alloy using pre-cladding ultrasonic processes;Welding in the World;2021-04-06

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