Laser soldering-Reference-Cited by-同舟云学术

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Laser soldering

Published:2008 Issue: Volume: Page:299-326
ISSN:
Container-title:Microjoining and Nanojoining
language:
Short-container-title:

Author:

Tian Y.H.,Wang C.Q.

Publisher

Elsevier

Link

http://woodhead.metapress.com/index/U341M71440G1K772.pdf

Reference35 articles.

1. The laser and microsoldering;Bohman,1974

2. Laser soldering boosts productivity;Kujawa,1982

3. Laser soldering of surface mounted assemblies;Lea;Hybrid Circuits,1987

4. CAPP for electronics manufacturing Case Study: Fine Pitch SMT laser soldering;Fidan;Journal of Electronic Packaging,2004

5. Reflow soldering by laser;Whitehead;ASME Heat Transfer Division,1990

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications;Energies;2023-08-08

2. Achieving the Minimum Roughness of Laser Milled Micro-Impressions on Ti 6Al 4V, Inconel 718, and Duralumin;Materials;2020-10-12

3. Magnetic properties assessment of laser welded ultra-thin Fe–Co–V foils;Journal of Alloys and Compounds;2014-12

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