1. Electromigration damage in mechanically deformed Al conductor lines: dislocations as fast diffusion paths;Baker;Acta Mater,2000
2. Microstructural characterization of inlaid copper interconnect lines;Besser;J Electron Mater,2001
3. Mass transport of aluminium by momentum exchange with conducting electrons;Black;IEEE Proc 6th Ann Int Reliab Phys Symp,1967
4. Modified reliability expression for the electromigration time-to-failure;Bobbio;Microelectron Reliab,1975
5. The diffraction of short electromagnetic waves by a crystal;Bragg;Proc Camb Philos Soc,1913