Electromigration-induced microstructural evolution in lead-free and lead–tin solders
Author:
Publisher
Elsevier
Link
http://woodhead.metapress.com/index/W3L0P23426646558.pdf
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3. Effect of temperature on microstructure changes of the Sn–9wt% Zn lead-free solder stripe under current stressing;Chen;Mater Chem Phys,2009
4. Electromigration and thermomigration in Pb-free flip-chip solder joints;Chen;Ann Rev Mater Res,2010
5. Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization;Chen;J Mater Res,2010
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