Introduction to electroless copper and nickel–phosphorus (Ni–P) depositions
Author:
Publisher
Elsevier
Link
http://woodhead.metapress.com/index/PP617101Q3560471.pdf
Reference4 articles.
1. Surface morphology and electronic state characterization of Ni–P amorphous alloy films;Li;JNon-Cryst Solids,2001
2. Electroless copper deposition using glyoxylic acid as reducing agent for ultralarge scale integration metallization;Shacham-Diamond;Electrochem Solid State Lett,2000
3. Effect of heat treatment on age hardening behaviour of electroless nickel–phosphorus coatings;Taheri;Mater Sci Technol,2001
4. Electrical resistivity of electroless nickel coated carbon fibers;Ten;Thin Solid Films,2001
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1. Surfactant-free commercial electroless bath with low concentration of SiC nanoparticles to prepare the NiP-SiC nanocomposite coatings;Materials Research Express;2021-05-01
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