1. Laser bonding of glass to silicon using polymer for microsystems packaging;Bardin;IEEE/ASME Journal of Microelectromechanical Systems,2007
2. Multi-aperture beam integration systems;Brown,2000
3. Self-aligning planarization and passivation for integration applications in III-V semiconductor devices;Demir;IEEE Transactions on Semiconductor Manufacturing,2005
4. Processing procedures for CYCLOTENE 4000 series photo BCB resins;Dow Chemical,2009
5. Cyclotene advanced electronics resins;Dow Chemical,2011