Non-destructive evaluation (NDE) of composites: dielectric methods for testing adhesive bonds in composites
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Publisher
Elsevier
Link
http://woodhead.metapress.com/index/P8592T8113427820.pdf
Reference30 articles.
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2. Dielectric and mechanical studies of the durability of adhesively bonded CFRP structures subjected to aging in various solvents;Banks;Proceedings of the Institution of Mechanical Engineers Part L – Journal of Materials – Design and Applications,2004
3. The history of Redux (R) and the Redux bonding process 11;Bishopp;International Journal of Adhesion and Adhesives,1997
4. Aerospace: A pioneer in structural adhesive bonding;Bishopp,2005
5. Dielectric Studies of Carbon Fibre Composite Bonded Systems;Boinard,2002
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