Author:
Martynenko N. S.,Bochvar N. R.,Rybalchenko O. V.,Prosvirnin D. V.,Rybalchenko G. V.,Kolmakov A. G.,Morozov M. M.,Yusupov V. S.,Dobatkin S. V.
Reference21 articles.
1. T. Wang, K. Lu, T. Qiu, X. Zeng, H. Ning, Z. Yang, Y. Li, Q. Ye, R. Yao, and J. Peng, “Highly conductive and adhesive ternary Cu–Cr–Zr alloy electrode for flexible optoelectronic applications,” Superlat. Microstruct. 157, 106989 (2021).
2. C. Xia, W. Zhang, Z. Kang, Y. Jia, Y. Wu, R. Zhang, G. Xu, and M. Wang, “High strength and high electrical conductivity Cu–Cr system alloys manufactured by hot rolling–quenching process and thermomechanical treatments,” Mater. Sci. Eng., A 538, 295–301 (2012).
3. D. K. Orlova, T. I. Chashchukhina, L. M. Voronova, and M. V. Degtyarev, “Influence of the temperature–rate deformation conditions in Bridgman anvils on the structure formation in commercial-purity copper,” Fiz. Met. Metalloved. 116 (9), 1–8 (2015).
4. C. Y. Ho, M. W. Ackerman, K. Y. Wu, T. N. Havill, R. H. Bogaard, R. A. Matula, S. G. Oh, and H. M. James, “Electrical resistivity of ten selected binary alloy systems,” J. Phys. Chem. Ref. Data 12 (2), 183–322 (1983).
5. X. Zhang, Y. Yuan, S. Zhao, J. Zhang, and Q. Yan, “Microstructure stability, softening temperature and strengthening mechanism of pure copper, CuCrZr and Cu–Al2O3 up to 1000°C,” Nucl. Mater. Energy 30, 101123 (2022).
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