Features of Controlled Laser Thermal Cleavage of Crystalline Silicon-Reference-Cited by-同舟云学术

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Features of Controlled Laser Thermal Cleavage of Crystalline Silicon

Published:2010-11 Issue:6 Volume:55 Page:933-937
ISSN:1063-7745
Container-title:Crystallography Reports
language:en
Short-container-title:Crystallogr. Rep.

Author:

Serdyukov A. N.,Shalupaev S. V.,Nikityuk Yu. V.

Publisher

Pleiades Publishing Ltd

Subject

Condensed Matter Physics,General Materials Science,General Chemistry

Link

http://link.springer.com/content/pdf/10.1134/S1063774510060064.pdf

Reference16 articles.

1. V. S. Kondratenko, RF Patent No. 2024441.

2. S. V. Shalupaev, E. B. Shershnev, A. N. Serdyukov, et al., Ceramics. Polish Ceramic Bulletin 65, 75 (2001).

3. V. K. Sysoev, B. P. Papchenko, A. V. Zakharchenko, et al., Opt. Zh. 71(2), 65 (2004).

4. C. Tsai and H. Chen, J. Mater. Proc. Technol. 136, 166 (2003).

5. S. V. Shalupaev, E. B. Shershnev, Yu. V. Nikityuk, et al., Opt. Zh. 73(5), 62 (2005).

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1. Determination of the Parameters of Controlled Laser Thermal Cleavage of Crystalline Silicon Using Regression and Neural Network Models;Crystallography Reports;2023-12

2. Multi-Criteria Optimization of Quartz Glass Laser Cleaving Parameters via Neural Network Simulation and Genetic Algorithm;2023 7th International Conference on Information, Control, and Communication Technologies (ICCT);2023-10-02

3. Modeling of Mechanical Influence of Double-Beam Laser on Single-Crystalline Silicon;Archives of Metallurgy and Materials;2013-12-01

4. Features of controlled laser thermal cleavage of crystal quartz;Crystallography Reports;2012-11

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