Effect of Annealing Twins on Grain Boundary Migration in High-Purity Copper
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Publisher
Pleiades Publishing Ltd
Link
https://link.springer.com/content/pdf/10.1134/S0031918X24600167.pdf
Reference37 articles.
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3. X. P. Chen, L. F. Li, H. F. Sun, L. X. Wang, and Q. Liu, “Studies on the evolution of annealing twins during recrystallization and grain growth in highly rolled pure nickel,” Mater. Sci. Eng.: A 622, 108–113 (2015). https://doi.org/10.1016/j.msea.2014.11.023
4. D. Horton, C. B. Thomson, and V. Randle, “Aspects of twinning and grain growth in high purity and commercially pure nickel,” Mater. Sci. Eng.: A 203, 408–414 (1995). https://doi.org/10.1016/0921-5093(95)09821-6
5. V. Randle, P. R. Rios, and Y. Hu, “Grain growth and twinning in nickel,” Scr. Mater. 58, 130–133 (2008). https://doi.org/10.1016/j.scriptamat.2007.09.016
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