Design of epoxide adhesive and sealing materials with high thermal conductivity-Reference-Cited by-同舟云学术

Design of epoxide adhesive and sealing materials with high thermal conductivity

Published:2012-10 Issue:4 Volume:5 Page:300-304
ISSN:1995-4212
Container-title:Polymer Science Series D
language:en
Short-container-title:Polym. Sci. Ser. D

Author:

Gladkikh S. N.,Vekshin N. N.,Kolesnikova E. V.,Tkachenko I. V.,Dreval’ T. N.

Publisher

Pleiades Publishing Ltd

Subject

Polymers and Plastics,General Chemical Engineering,General Chemistry

Link

http://link.springer.com/content/pdf/10.1134/S1995421212040077.pdf

Reference5 articles.

1. GOST 50109-92. Nonmetallic Materials. Method of Test for Weight Loss and Content of Volatile Condensable Materials under Vacuum-Thermal Treatment.

2. S. N. Gladkikh, L. I. Kuznetsova, L. I. Naumova, and A. I. Vyalov, Pol. Sci. Ser. D, 2(3), 238–242 (2009).

3. I. I. Potapochkina, N. P. Korotkova, V. N. Tarasov, and V. S. Lebedev, Klei. Germetiki. Tekhnologii, No. 7, 14–17 (2006).

4. Ya. A. Abeliolov, Issues of thermal conductivity of polymeric adhesives, heat-conducting properties of the fillers, in Proc. Workshop TsRDZ, Moscow, April 27, 2005 (TsRDZ, Moscow, 2005) [in Russian].

5. D. A. Kardashov and A. P. Petrova, Polymeric Adhesives (Khimiya, Moscow, 1983) [in Russian].

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