1. V. Yu. Kireev and A. A. Stolyarov, Microelectronics Technology. Chemical Vapor Deposition (Tekhnosfera, Moscow, 2006) [in Russian].
2. M. Gutsche, H. Seidl, T. Hecht, and U. Schroeder, “Atomic layer deposition for advanced DRAM applications,” in Future Fab, No. 14 (Technology Publ., London, UK, 2003), pp. 213–217.
3. T. V. Semikina, V. N. Komashchenko, and L. N. Shmyreva, “Nanotechnology: the basics of the method of atomic layer deposition, equipment, application in nanoelectronics,” Elektron. Svyaz’, Elektron. Nanotekhnol., No. 1, 60–66 (2009).
4. Atomic Layer Deposition for Semiconductors, Ed. by Ch. S. Hwang and Ch. Y. Yoo (Springer Science, New York, 2014).
5. D. Vogler and P. Doe, “Atomic layer deposition special report: where’s the metal?,” Solid State Technol. 46, 35–40 (2003).