Author:
Volkov A. Yu.,Novikova O. S.,Kostina A. E.,Antonov B. D.
Subject
Materials Chemistry,Condensed Matter Physics
Reference30 articles.
1. S. Gorsse, B. Ouvrard, M. Goune, and A. Poulon-Quintin, “Microstructural design of new high conductivity–high strength Cu-based alloy,” J. Alloys Compd. 633, 42–47 (2015).
2. K. Maki, Y. Ito, H. Matsunaga, and H. Mori, “Solidsolution copper alloys with high strength and high electrical conductivity,” Scr. Mater. 68, 777–780 (2013).
3. R. K. Sitarama, S. V. Subramanya, A. Kauffmann, Z. Hegedus, J. Gubicza, M. Peterlechner, J. Freudenberger, and G. Wilde, “High strength and ductile ultrafine-grained Cu–Ag alloy through bimodal grain size, dislocation density and solute distribution,” Acta Mater. 61, 228–238 (2013).
4. E. N. Popova, E. P. Romanov, and S. V. Sudareva, “A15 superconducting composites and high-strength Cu–Nb conductors,” Phys. Met. Metallogr. 96, 146–159 (2003).
5. R. K. Islamgaliev, K. M. Nesterov, and R. Z. Valiev, “Structure, strength, and electric conductivity of a Cu–Cr copper-based alloy subjected to severe plastic deformation,” Phys. Met. Metallogr. 116, 209–218 (2015).
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