Regimes of water droplet evaporation on copper substrates-Reference-Cited by-同舟云学术

Regimes of water droplet evaporation on copper substrates

Published:2016-05 Issue:3 Volume:78 Page:335-339
ISSN:1061-933X
Container-title:Colloid Journal
language:en
Short-container-title:Colloid J

Author:

Kuznetsov G. V.,Feoktistov D. V.,Orlova E. G.,Batishcheva K. A.

Publisher

Pleiades Publishing Ltd

Subject

Colloid and Surface Chemistry,Physical and Theoretical Chemistry,Surfaces and Interfaces

Link

http://link.springer.com/content/pdf/10.1134/S1061933X1603008X.pdf

Reference28 articles.

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3. Misyura, S.Ya., Nakoryakov, V.E., and Elistratov, S.L., Dokl. Akad. Nauk, 2013, vol. 448, pp. 293.

4. Summ, B.D. and Goryunov, Yu.V., Fiziko-khimicheskie osnovy smachivaniya i rastekaniya (Physicochemical Fundamentals of Wetting and Spreading), Moscow: Khimiya, 1976.

5. Sorokin, Yu.V. and Khlynov, V.V., Zh. Fiz. Khim., 1967, vol. 41, pp. 1764.

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