1. Mishra, M.K., Dubey, V., Mishra, P.M., and Khan, I., MEMS technology: A review, J. Eng. Res. Rep., 2019, vol. 4, no. 1, pp. 1–24. https://doi.org/10.9734/jerr/2019/v4i116891
2. Evstafyev, S., Samoylikov, V., Timoshenkov, S., and Gornostaev, P., Designing thermal MEMS on a system level, Proc. SPIE, 2021, vol. 12157, p. 121570M. https://doi.org/10.1117/12.2619684
3. Blank, T.V. and Gol’dberg, Yu.A., Mechanisms of current flow in ohmic metal-semiconductor contacts, Semiconductors, 2007, vol. 41, no. 11, pp. 1263–1292. https://doi.org/10.1134/S1063782607110012
4. Belyaev, A.E., Boltovets, N.S., Venger, E.F., Volkov, E.G., Klad’ko, V.P., Konakova, R.V., Kudrik, Ya.Ya., Milenin, V.V., Milenin, G.V., Pilipenko, V.A., Red’ko, R.A., and Sachenko, A.V., Fizicheskie metody diagnostiki v mikro-i nanoelektronike (Physical Methods of Diagnostics in Micro- and Nanoelectronics), Belyaev, A.E. and Konakova, R.V., Eds., Kharkov: ISMA, 2011.