1. Nenashev, A.P., Konstruirovanie radioelektronnykh sredstv (Design of Electronic Equipment), Moscow: Vysshaya Shkola, 1990.
2. Chang, C.C., Ke, M.T., and Chen, S.L., Thermoelectric air-cooling module for Chang electronic devices, Appl. Therm. Eng., 2009, vol. 29, no. 13, pp. 2731–2737.
3. Zhu, L., Tan, H., and Yu, J., Analysis on optimal heat exchanger size of thermoelectric cooler for electronic cooling applications, Energy Convers. Manage., 2013, vol. 76, pp. 685–690.
4. Vasil’ev, E.N., Geints, E.R., Derevyanko, V.A., Kokov, E.G., and Kukushkin, S.V., Thermoelectric cooling unit, Zh. Sib Fed. Univ.,Ser. Tekh. Tekhnol., 2019, vol. 12, no. 2, pp. 146–152.
5. Vasil’ev, E.N. and Derevyanko, V.A., The analysis of thermoelectric module efficiency in the cooling systems, Vestn. SibGAU, 2013, no. 4 (50), pp. 9–13.