Filler-matrix thermal boundary resistance of diamond-copper composite with high thermal conductivity-Reference-Cited by-同舟云学术

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Filler-matrix thermal boundary resistance of diamond-copper composite with high thermal conductivity

Published:2012-01 Issue:1 Volume:54 Page:210-215
ISSN:1063-7834
Container-title:Physics of the Solid State
language:en
Short-container-title:Phys. Solid State

Author:

Abyzov A. M.,Kidalov S. V.,Shakhov F. M.

Publisher

Pleiades Publishing Ltd

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1134/S1063783412010027.pdf

Reference37 articles.

1. S. V. Kidalov and F. M. Shakhov, Materials 2, 2467 (2009).

2. High Thermal Conductivity Materials, Ed. by S. L. Shinde and J. S. Goela (Springer, New York, 2006).

3. Synthetic CVD Diamond Products from Element Six; http://www.e6cvd.com .

4. ExtreMat-Heat Sink Materials; http://www.extremat.org/heat-sink-materials?Edition=en .

5. K. Hanada, K. Matsuzaki, and T. Sano, J. Mater. Process. Technol. 153–154, 514 (2004).

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