1. Hhh Drexhage, P. and Beckedahl, P., Thermal Paste Application/Rev. 7, SEMIKRON INTERNATIONAL GmbH, 2018.
2. Dieter, E., Thermal Paste Application/Rev. 7, SEMIKRON INTERNATIONAL GmbH, 2010.
3. Schulz, M., Thermal Interface—an Inconvenient Truth, Article Bodo’s Power Systems, 2010, no. 6.
4. Smirnov, M., The use of heat-conducting paste. Electronics production, Tekhnol. Oborud. Mater., 2013, no. 3, pp. 119–123.
5. Kolpakov, A., SEMITOP power modules as an alternative to discrete TE casings, Silovaya Elektron., 2004, no. 2, pp. 32–35.