Efficient Pre-Bond Testing of TSV Defects Based on IEEE std. 1500 Wrapper Cells
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Published:2016-04-30
Issue:2
Volume:16
Page:226-235
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ISSN:1598-1657
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Container-title:JSTS:Journal of Semiconductor Technology and Science
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language:en
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Short-container-title:JSTS:Journal of Semiconductor Technology and Science
Author:
Jung Jihun,Ansari Muhammad Adil,Kim Dooyoung,Park Sungju
Publisher
The Institute of Electronics Engineers of Korea
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials