Digitale Specklemusterinterferometrie zur Messung thermischer Dehnungen bei Metall-Keramik-Verbundbauteilen / Digital speckle pattern interferometry applied to thermal strain measurements of metal - ceramic compounds
Author:
Aswendt P.,Höfling R.,Totzauer W.
Publisher
Walter de Gruyter GmbH
Subject
Electrical and Electronic Engineering,Instrumentation
Cited by
1 articles.
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1. PUBLICATIONS ON THERMAL STRESSES;Journal of Thermal Stresses;1991-01