Affiliation:
1. National Research University of Electronic Technology
2. AO "Nauchno-issledovatel'skiy institut elektronnoy tehniki"
Abstract
This review article discusses methods for measuring the main mechanical properties of thin films: tensile testing, indentation, evaluation of the mechanical strength margin for the curvature of the plate-thin film system, bulge method and research using a deformed and resonant cantilever. In the process of critical analysis of domestic and foreign literary sources, the advantages and disadvantages of the methods were revealed; the authors' motivation for conducting such studies was explained. In addition to the existing widely used methods, an original and relatively new technique is given - the use of electric current as a controlled means of applying thermo mechanical stresses to electrical conductors to characterize their fatigue behavior. Approaches for increasing the mechanical strength of thin films are also indicated.
Publisher
Infra-M Academic Publishing House
Reference52 articles.
1. Technique for Analyzing Volumetric Defects Using Digital Elevation Model of a Surface / A.A. Dedkova, I.V. Florinsky, E.E. Gusev [et. al.] // Russian Journal of Nondestructive Testing. – 2021. – Vol. 57(11). – Pp. 1000–1007. – DOI: 10.31857/S01303082211100., Technique for Analyzing Volumetric Defects Using Digital Elevation Model of a Surface / A.A. Dedkova, I.V. Florinsky, E.E. Gusev [et. al.] // Russian Journal of Nondestructive Testing. – 2021. – Vol. 57(11). – Pp. 1000–1007. – DOI: 10.31857/S01303082211100.
2. Fonseca, D.J. On MEMS Reliability and Failure Mechanisms / D.J. Fonseca, M. Sequera // International Journal of Quality, Statistics and Reliability. – 2011. – P. 1–7. - DOI: 10.1155/2011/820243., Fonseca, D.J. On MEMS Reliability and Failure Mechanisms / D.J. Fonseca, M. Sequera // International Journal of Quality, Statistics and Reliability. – 2011. – P. 1–7. - DOI: 10.1155/2011/820243.
3. Microelectromechanical System Sensor Market by Type and Application: Global Opportunity Analysis and Industry Forecast, 2019-2026, Allied Market Research. – URL: Microelectromechanical System Market by Type, and Application: Global Opportunity Analysis and Industry Forecast, 2019-2026 (researchandmarkets.com) (дата обращения: 07.07.2022)., Microelectromechanical System Sensor Market by Type and Application: Global Opportunity Analysis and Industry Forecast, 2019-2026, Allied Market Research. – URL: Microelectromechanical System Market by Type, and Application: Global Opportunity Analysis and Industry Forecast, 2019-2026 (researchandmarkets.com) (data obrascheniya: 07.07.2022).
4. Microelectromechanical Systems for Nanomechanical Testing: Electrostatic Actuation and Capacitive Sensing for High-Strain-Rate Testing / C. Li, D. Zhang, G. Cheng, Y. Zhu // Experimental Mechanics. – 2020. – Vol. 60. – P. 329–343. – DOI: 10.1007/s11340-019-00565-5., Microelectromechanical Systems for Nanomechanical Testing: Electrostatic Actuation and Capacitive Sensing for High-Strain-Rate Testing / C. Li, D. Zhang, G. Cheng, Y. Zhu // Experimental Mechanics. – 2020. – Vol. 60. – P. 329–343. – DOI: 10.1007/s11340-019-00565-5.
5. Khan, N. Design and development of a MEMS butterfly resonator using synchronizing beam and out of plane actuation / N. Khan, M.J. Ahamed // Microsystem Technologies. – 2020. – Vol. 26. – Pp. 1643-1652. – DOI: 10.1007/s00542-019-04705-8., Khan, N. Design and development of a MEMS butterfly resonator using synchronizing beam and out of plane actuation / N. Khan, M.J. Ahamed // Microsystem Technologies. – 2020. – Vol. 26. – Pp. 1643-1652. – DOI: 10.1007/s00542-019-04705-8.