Interconnecting drivers to flexible displays-Reference-Cited by-同舟云学术

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Interconnecting drivers to flexible displays

Published:2008 Issue:7 Volume:16 Page:765
ISSN:1071-0922
Container-title:Journal of the Society for Information Display
language:en
Short-container-title:J. Soc. Inf. Display

Author:

Govaerts Jonathan,Vandecasteele Bjorn,Vanfleteren Jan

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. http://www.hitachichem.co.jp/english/products/do/index.html.

2. http://www.plasticlogic.com/.

3. B. Vandecasteele, J. Maattanen, T. Podprocky, and J. Vanfleteren, “Low temperature flip chip attachment for flexible display applications,”Proc. Intl. Conf. Electronics Packaging, 307312 (2004).

4. MilStd883, Method 2019.7: Die shear strength, March 7th, 2003.

5. http://www.st.com.

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2. 10‐2: Study of an Ultra‐fast Photonic Soldering Technology without Thermal Damage in Display Module Package;SID Symposium Digest of Technical Papers;2021-05

3. 16.4: Ultra-Thin Chip Packaging (UTCP): A Promising Technology for Future Flexible Display Interconnection;SID Symposium Digest of Technical Papers;2009

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