Low-cost display assembly and interconnect using ink-jet printing technology-Reference-Cited by-同舟云学术

Low-cost display assembly and interconnect using ink-jet printing technology

Published:2001 Issue:1 Volume:9 Page:9
ISSN:1071-0922
Container-title:Journal of the Society for Information Display
language:en
Short-container-title:J. Soc. Inf. Display

Author:

Hayes Donald J.,Cox W. Royall,Grove Michael E.

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. D. B. Wallace, “A method of characteristics model of a drop-on-demand ink-jet device using an integral method drop formation model,”ASME Publication89-WA/FE-4 (December, 1989).

2. D. J. Hayes, D. B. Wallace, and M. T. Boldman, “Solder jet for low cost wafer bumping,”Proc ISHM '96(October 1996).

3. D. B. Wallace and D. J. Hayes, “Solder jet technology update,”Proc ISHM '97(October, 1997) andThe International Journal of Microcircuits and Electronic Packaging21, No. 1 (1998).

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