First-principles study of adhesion atCu/SiO2interfaces
Author:
Publisher
American Physical Society (APS)
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.68.125403/fulltext
Reference46 articles.
1. Multilevel interconnections for ULSI and GSI era
2. The adhesion of evaporated metal films on glass
3. Thin film metallization of oxides in microelectronics
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