Electronic mechanism for toughness enhancement inTixM1−xN(M=Moand W)
Author:
Publisher
American Physical Society (APS)
Subject
Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.81.104107/fulltext
Reference43 articles.
1. Microstructural design of hard coatings
2. Self-organized nanostructures in the Ti–Al–N system
3. Mechanical properties and machining performance of Ti1−xAlxN-coated cutting tools
4. Yttrium-induced structural changes in sputtered Ti1−xAlxN thin films
5. Mechanical properties and phase structure of (TiAlZr)N films deposited by multi arc ion plating
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