Author:
Lee Mal-Soon,Poudeu Ferdinand P.,Mahanti S. D.
Publisher
American Physical Society (APS)
Subject
Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Cited by
11 articles.
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1. Introduction of interstitial Cu atoms is beneficial to improving the thermoelectric performance of TiNiSn;Materials Today Communications;2024-08
2. Investigation of the dynamical stability, electronic and thermoelectric properties of RhMnTiZ (Z=Si, Ge, Sn) Heusler compounds;Solid State Communications;2023-04
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4. Thermoelectric properties and transport mechanism of Cu0.5In0.5Cr2Se4 and its Zn-doped samples;Journal of Alloys and Compounds;2022-07
5. First-principles study of the structural, electronic, optical, and thermoelectric properties of the RhVZ (Z= Si, Ge, Sn);Micro and Nanostructures;2022-04