Atomic simulation of grain-boundary sliding and migration in copper
Author:
Publisher
American Physical Society (APS)
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.65.012107/fulltext
Reference13 articles.
1. Grain boundary diffusion: recent progress and future research
2. Intergranular segregation and ordering effect: A mixed Monte Carlo mean-field approach
3. Diffusion mechanisms in Cu grain boundaries
4. Sliding Mechanisms in Aluminum Grain Boundaries
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