Thermally Activated Point Defect Migration in Copper
Author:
Publisher
American Physical Society (APS)
Subject
General Physics and Astronomy
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRev.120.411/fulltext
Reference36 articles.
1. Interstitial and vacancy migration in Cu3Au and copper
2. Electrical Resistivity Study of Lattice Defects Introduced in Copper by 1.25-Mev Electron Irradiation at 80°K
3. Discrete Recovery Spectrum below 65°K in Irradiated Copper
4. Recovery of Electron-Irradiated Copper. I. Close Pair Recovery
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