Electrodeposition of copper applied to the manufacture of seamless superconducting rf cavities-Reference-Cited by-同舟云学术

Electrodeposition of copper applied to the manufacture of seamless superconducting rf cavities

Published:2021-08-16 Issue:8 Volume:24 Page:
ISSN:2469-9888
Container-title:Physical Review Accelerators and Beams
language:en
Short-container-title:Phys. Rev. Accel. Beams

Author:

Amador L. Lain^ORCID,Chiggiato P.,Ferreira L. M. A.^ORCID,Garcia-Tabares E.^ORCID,Koettig T.,Meyer M. S.,Perez-Fontenla A. T.^ORCID,Puthran K.^ORCID,Rosaz G.^ORCID,Taborelli M.^ORCID

Funder

CERN

Publisher

American Physical Society (APS)

Subject

Surfaces and Interfaces,Physics and Astronomy (miscellaneous),Nuclear and High Energy Physics

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevAccelBeams.24.082002/fulltext

Reference30 articles.

1. 50 years of success for SRF accelerators—a review

2. Superconducting RF materials other than bulk niobium: a review

3. 20 Years of experience with the Nb/Cu technology for superconducting cavities and perspectives for future developments

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