Thermal Conductivity Enhancement in MoS2 under Extreme Strain-Reference-Cited by-同舟云学术

Thermal Conductivity Enhancement in MoS2 under Extreme Strain

Published:2019-04-18 Issue:15 Volume:122 Page:
ISSN:0031-9007
Container-title:Physical Review Letters
language:en
Short-container-title:Phys. Rev. Lett.

Author:

Meng Xianghai,Pandey Tribhuwan,Jeong Jihoon,Fu Suyu,Yang Jing,Chen Ke,Singh Akash,He Feng,Xu Xiaochuan,Zhou Jianshi,Hsieh Wen-Pin,Singh Abhishek K.,Lin Jung-Fu,Wang Yaguo

Funder

National Science Foundation

U.S. Department of Energy

U.S. Department of Defense

Department of Science and Technology, Ministry of Science and Technology

Publisher

American Physical Society (APS)

Subject

General Physics and Astronomy

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevLett.122.155901/fulltext

Reference84 articles.

1. Strain effects on the thermal conductivity of nanostructures

2. Strain engineering of thermal conductivity in graphene sheets and nanoribbons: a demonstration of magic flexibility

3. In-plane and cross-plane thermal conductivities of molybdenum disulfide

4. Negative correlation between in-plane bonding strength and cross-plane thermal conductivity in a model layered material

5. Quantifying van der Waals Interactions in Layered Transition Metal Dichalcogenides from Pressure-Enhanced Valence Band Splitting

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