Shock Compression of Liquid Helium to 56 GPa (560 kbar)-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Shock Compression of Liquid Helium to 56 GPa (560 kbar)

Published:1984-09-24 Issue:13 Volume:53 Page:1248-1251
ISSN:0031-9007
Container-title:Physical Review Letters
language:en
Short-container-title:Phys. Rev. Lett.

Author:

Nellis W. J.,Holmes N. C.,Mitchell A. C.,Trainor R. J.,Governo G. K.,Ross M.,Young D. A.

Publisher

American Physical Society (APS)

Subject

General Physics and Astronomy

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevLett.53.1248/fulltext

Reference12 articles.

1. High-Pressure Melting Curve ofHe4

2. Interiors of the Giant Planets

3. Equation‐of‐state data for molecular hydrogen and deuterium at shock pressures in the range 2–76 GPa (20–760 kbar)a)

4. The equation of state of molecular hydrogen at very high densitya)

5. The repulsive 1 Σg+ He2potential obtained from total cross sections

Cited by 129 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Particle Migration on the Relaxation of Shock Wave Collisions;Entropy;2024-08-25

2. Fluid-phase helium: Shock-compression experiments, quantum molecular dynamics simulations, and development of an equation of state;Physical Review B;2023-10-18

3. Current challenges in the physics of white dwarf stars;Physics Reports;2022-11

4. Multishock to Quasi-Isentropic Compression of Dense Gaseous Deuterium-Helium Mixtures up to 120 GPa: Probing the Sound Velocities Relevant to Planetary Interiors;Physical Review Letters;2021-02-15

5. Path integral Monte Carlo and density functional molecular dynamics simulations of warm dense MgSiO3;Physical Review B;2020-01-21

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3