Superconformal Electrodeposition in Submicron Features
Author:
Publisher
American Physical Society (APS)
Subject
General Physics and Astronomy
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevLett.87.016102/fulltext
Reference10 articles.
1. Damascene copper electroplating for chip interconnections
2. Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives
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