Oblique incidence deposition of Cu/Cu(001): Enhanced roughness and ripple formation-Reference-Cited by-同舟云学术

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Oblique incidence deposition of Cu/Cu(001): Enhanced roughness and ripple formation

Published:2010-03-15 Issue:11 Volume:81 Page:
ISSN:1098-0121
Container-title:Physical Review B
language:en
Short-container-title:Phys. Rev. B

Author:

Rabbering Frits L. W.,Stoian Georgiana,van Gastel Raoul,Wormeester Herbert,Poelsema Bene

Publisher

American Physical Society (APS)

Subject

Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.81.115425/fulltext

Reference35 articles.

1. Oblique evaporation and surface diffusion

2. Enhanced birefringence in vacuum evaporated silicon thin films

3. Developing 1D nanostructure arrays for future nanophotonics

4. Magnetic and structural properties of Co‐Ni thin films prepared by oblique incidence deposition

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Localized segregation of gold in ultrathin Fe films on Au(001);Physical Review B;2018-02-08

2. Fe on W(001) from continuous films to nanoparticles: Growth and magnetic domain structure;Physical Review B;2017-02-06

3. Onset of shadowing-dominated growth of Ag films in glancing angle deposition: Kinetic Monte Carlo simulation;Applied Surface Science;2013-01

4. Effects of shadowing on the scaling behavior of the ballistic deposition model;Acta Physica Sinica;2012

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