Vertebroplasty
Author:
Publisher
Elsevier BV
Subject
Anesthesiology and Pain Medicine
Reference22 articles.
1. Minimally invasive procedures for disorders of the lumbar spine;Deen;Mayo Clin Proc,2003
2. Minimally invasive treatments of osteoporotic vertebral compression fractures;Phillips;Spine,2003
3. Future directions;Bostrom;Spine,1997
4. Local neurotoxicity of methyl methacrylate among dental technicians;Sappalainen;Am J Ind Med,1984
5. Leakage of cement in percutaneous transpedicular vertebroplasty for painful osteoporotic compression fractures;Yeom;J Bone Joint Surg [Br],2003
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Unilateral Percutaneous Kyphoplasty In Patients With Painful Osteoporotic Vertebral Compression Fractures; Single Center Experience;Bozok Tıp Dergisi;2023-11-14
2. A Comparison of Percutaneous Kyphoplasty with High-Viscosity and Low-Viscosity Bone Cement for Treatment of Osteoporotic Vertebral Compression Fractures: A Retrospective Study;Geriatric Orthopaedic Surgery & Rehabilitation;2022-01
3. Efficacy of Percutaneous Vertebroplasty in the Treatment of Malignant and Benign Vertebral Fractures: Single-Center Experiences;Journal of Clinical Interventional Radiology ISVIR;2021-05-18
4. Treating osteoporotic vertebral compression fractures with intraosseous vacuum phenomena using high-viscosity bone cement via bilateral percutaneous vertebroplasty;Medicine;2017-04
5. Mechanical properties of α-tricalcium phosphate-based bone cements incorporating regenerative biomaterials for filling bone defects exposed to low mechanical loads;Journal of Biomedical Materials Research Part B: Applied Biomaterials;2015-02-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3