Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing-Reference-Cited by-同舟云学术

Dynamic analysis of electromagnetic compaction of Ag-Cu-Sn multivariate mixed metal powders for brazing

Published:2019-05-30 Issue:3 Volume:60 Page:457-476
ISSN:1383-5416
Container-title:International Journal of Applied Electromagnetics and Mechanics
language:
Short-container-title:JAE

Author:

Yan Shiwei¹²,Lei Yu¹,Huang Shangyu¹²,Wang Qiong³,Zhou Mengcheng¹,Hu Jianhua¹,Zou Fangli¹

Affiliation:

1. , Wuhan University of Technology, , China

2. , Huazhong University of Science and Technology, , China

3. , , China

Publisher

IOS Press

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

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5. Thermoelectric properties of n-type 95%Bi2Te3–5%Bi2Se3 materials fabricated by magnetic pulsed compaction (MPC);Bhuiyan;Intermetallics,2013

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