Enhancement gain of broadband elliptical microstrip patch array antenna with mutual coupling for wireless communication

Author:

Jassim Ali Khalid,Thaher Raad H.

Abstract

<p>The paper is presented analysis, design and manufacturing single optimize parameters of a new broadband elliptical patch antenna with microstrip center feed line and the array has been implemented to improve gain antenna. The antenna array dimension of mm<sup>3</sup> and fabricated on an FR-4 epoxy substrate having relative dielectric constant =4.3, loss tangent tan (δ) =0.002 and the feed line used has characteristic impedance of 50Ω and added the triangle notch structure .Thus notch can achieve maximal additional enhancement impedance bandwidth are (3.679- 6.578) GHz, (13.84-25.142) GHz, (29.807-37.618) GHz and the gain 8dBi. The antenna array performance was modified by inserting stubs transition in feeding Microstrip line to reducing mutual coupling achieve impedance bandwidth (when S<sub>11</sub>-10dB). The modified antenna was designed to be used for wireless communication application. The simulation results are obtained using CST software.</p>

Publisher

Institute of Advanced Engineering and Science

Subject

Electrical and Electronic Engineering,Control and Optimization,Computer Networks and Communications,Hardware and Architecture,Information Systems,Signal Processing

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Single Layer Metamaterial Superstrate for Gain Enhancement of A Microstrip Antenna Array;Diyala Journal of Engineering Sciences;2024-06-07

2. Gain Improvement for Single Band Ultra-Wideband Antenna by Slots Technique;2024 21st International Multi-Conference on Systems, Signals &amp; Devices (SSD);2024-04-22

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4. Study the Effect of Dielectric Permittivity and Changing Substrates Material on Microstrip Patch Antenna;2022 International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA);2022-06-09

5. Enhancement isolation antenna to multi-port for wireless communication;Open Engineering;2022-01-01

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