Photo-chemically assisted redox-nano welding for highly conductive and robust copper-based electrodes-Reference-Cited by-同舟云学术

Photo-chemically assisted redox-nano welding for highly conductive and robust copper-based electrodes

Published:2023 Issue:22 Volume:11 Page:7383-7388
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Lee Jae-Won¹,Lee Sang Min²,Kwak Ji Hye³,Kim Juhee⁴,Kim Sung Jin¹,Hong Kyong-Soo⁵,Yoo Kye Sang²,Yang Imjeong H.-S¹^ORCID,Jeong Hee Jin⁴

Affiliation:

1. Department of Physics, Pusan National University, Busan 46241, South Korea

2. Department of Chemical & Biomolecular Engineering, Seoul National University of Science & Technology, Seoul 01811, Republic of Korea

3. Electrical Environment Research Center, Power Grid Research Division, Korea Electrotechnology Research Institu(KERI), Changwon 51543, Republic of Korea

4. Nano Hybrid Technology Research Center, Creative and Fundamental Research Division, Korea Electrotechnology Research Institute (KERI), Changwon 51543, Republic of Korea

5. Busan Center, Korea Basic Science Institute (KBSI), Busan 46742, South Korea

Abstract

In this study, high-quality conductive electrodes were fabricated by improving the sintering efficiency and packing density of Cu sub-microparticle (sub-μP) electrodes through IPL sintering with redox reaction-induced nano-welding.

Funder

Nano-Convergence Foundation

Korea Basic Science Institute

National Research Foundation of Korea

Korea Electrotechnology Research Institute

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/TC/D3TC00828B

Reference31 articles.

1. Electrolyte-Gated Transistors for Organic and Printed Electronics

2. Conductive Nanomaterials for Printed Electronics

3. A New Frontier of Printed Electronics: Flexible Hybrid Electronics

4. Multicolor Organic Light-Emitting Diodes Processed by Hybrid Inkjet Printing

5. One-step fabrication of a highly conductive and durable copper paste and its flexible dipole tag-antenna application