Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films-Reference-Cited by-同舟云学术

Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

Published:2022 Issue:74 Volume:58 Page:10337-10340
ISSN:1359-7345
Container-title:Chemical Communications
language:en
Short-container-title:Chem. Commun.

Author:

Wagner Jessica R.¹,Fletcher Jared¹,Morin Stephen A.¹²³^ORCID

Affiliation:

1. Department of Chemistry, University of Nebraska–Lincoln, Hamilton Hall, Lincoln, NE 68588, USA

2. Nebraska Center for Materials and Nanoscience, University of Nebraska–Lincoln, Lincoln, NE 68588, USA

3. Nebraska Center for Integrated Biomolecular Communication, University of Nebraska, Lincoln, NE 68588, USA

Abstract

A metal-chelating polymer (PEI) was used to modify the surface of commodity plastics, yielding a generalizable procedure for producing strongly adhered metallic traces using electroless deposition.

Funder

National Science Foundation

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,General Chemistry,Ceramics and Composites,Electronic, Optical and Magnetic Materials,Catalysis

Link

http://pubs.rsc.org/en/content/articlepdf/2022/CC/D2CC03848J

Reference36 articles.

1. Electroless Deposition Metals on Poly(dimethylsiloxane) with Strong Adhesion As Flexible and Stretchable Conductive Materials

2. Printed Circuit Board (PCB) Technology for Electrochemical Sensors and Sensing Platforms

3. Hybrid fabrication of LED matrix display on multilayer flexible printed circuit board

4. A New Approach for Microfabrication of Printed Circuit Boards with Ultrafine Traces

5. Metallic composite coatings by electroless technique – a critical review

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