Design of a flexible surface/interlayer for packaging

Author:

Zhan Fei12,Gao Weina1,Zhao Feng3,Qin Peng4,Sun Xinlong5,Sun Chenkun4,Tang Shousheng4,Wang Lei4ORCID

Affiliation:

1. Third Orthopedics Department, Baoding No. 1 Central Hospital, Hebei 071000, China

2. School of Electrical and Electronic Engineering, Shijiazhuang Tiedao University, Hebei 050043, China

3. Specialized Robot Engineering and Technological Centre of Hainan Province, Hainan Vocational University of Science and Technology, Haikou 571126, China

4. Beijing Key Lab of Cryo-Biomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China

5. School of Textile Science and Engineering, Xi’an Polytechnic University, Xi’an, Shaanxi, 710048, China

Abstract

A flexible multi-level topography and hollow interlayer not only reduce the maximum stress and maximum strain on the surface of the structure (a–e), but also enhance the thermal isolation performance (f).

Funder

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

Condensed Matter Physics,General Chemistry

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