Advancing the dynamic mechanical analysis of organic semiconductor materials-Reference-Cited by-同舟云学术

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Advancing the dynamic mechanical analysis of organic semiconductor materials

Published:2024 Issue: Volume: Page:
ISSN:1359-7345
Container-title:Chemical Communications
language:en
Short-container-title:Chem. Commun.

Author:

Feng Jintao¹^ORCID,Sun Chunlong¹,Li Saimeng¹,Ye Long¹^ORCID

Affiliation:

1. School of Materials Science & Engineering, Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Key Laboratory of Organic Integrated Circuits, Ministry of Education, Collaborative Innovation Center of Chemical Science and Engineering (Tianjin), Tianjin University, Tianjin 300350, China

Abstract

Dynamic mechanical analysis (DMA) is powerful for characterizing the mechanical properties of organic/polymeric semiconductors.

Funder

Science Fund for Distinguished Young Scholars of Tianjin Municipality

Tianjin University

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/CC/D4CC03254C

Reference83 articles.

1. Multiphoton Lithography of Organic Semiconductor Devices for 3D Printing of Flexible Electronic Circuits, Biosensors, and Bioelectronics

2. Transferable Organic Semiconductor Nanosheets for Application in Electronic Devices

3. Unveiling the Strain‐induced Microstructural Evolution and Morphology‐Stretchability Correlations of Intrinsically Stretchable Organic Photovoltaic Films

4. Cyano-functionalized organic and polymeric semiconductors for high-performance n-type organic electronic devices

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