Fatigue behavior of freestanding nickel–molybdenum–tungsten thin films with high-density planar faults-Reference-Cited by-同舟云学术

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Fatigue behavior of freestanding nickel–molybdenum–tungsten thin films with high-density planar faults

Published:2024 Issue:25 Volume:16 Page:12050-12059
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Park JungHun¹^ORCID,Park Yuhyun¹,Choi Sunkun¹,Lee Zhuo Feng¹,Sim Gi-Dong¹^ORCID

Affiliation:

1. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology 291, Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea

Abstract

Ni–Mo–W thin films with atomic-scale planar faults possess an unprecedented fatigue strength exceeding 2 GPa beyond 106 cycles.

Funder

National Research Foundation of Korea

KAIST

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/NR/D4NR01033G

Reference82 articles.

1. Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

2. Revealing the Maximum Strength in Nanotwinned Copper

3. Ultrahigh Strength and High Electrical Conductivity in Copper

4. Optimization of strength and ductility in nanotwinned ultra-fine grained Ag: Twin density and grain orientations

5. Fundamental differences in the plasticity of periodically twinned nanowires in Au, Ag, Al, Cu, Pb and Ni

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