Exploring material chemistry for direct ink writing of reactively formed conductors
Author:
Affiliation:
1. Department of Materials Science and Engineering
2. Johns Hopkins University
3. Baltimore
4. USA
5. Hopkins Extreme Materials Institute
6. Microsystems & Advanced Materials Division
7. The Charles Stark Draper Laboratory, Inc.
8. Cambridge
Abstract
Rational design of a reactive material for 3D printing robust electrical conductors which can be integrated into parts or systems.
Funder
Charles Stark Draper Laboratory
Publisher
Royal Society of Chemistry (RSC)
Subject
Microbiology
Link
http://pubs.rsc.org/en/content/articlepdf/2020/MA/D0MA00148A
Reference57 articles.
1. Progress in Additive Manufacturing and Rapid Prototyping
2. Additive manufacturing and its societal impact: a literature review
3. The 3D printing order: variability, supercenters and supply chain reconfigurations
4. Reactive Silver Inks for Patterning High-Conductivity Features at Mild Temperatures
5. Inkjet printing and photonic sintering of silver and copper oxide nanoparticles for ultra-low-cost conductive patterns
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Energy-efficient rapid additive manufacturing of complex geometry ceramics;Journal of Cleaner Production;2024-05
2. Low-Carbon Manufacturing of Ti–Si–C Ceramics Using Geopolymer-Binder-Integrated Reactive Feedstocks;ACS Sustainable Chemistry & Engineering;2024-03-13
3. Reactive multilayer nanofilms: time of scientific and technological maturity;Russian Chemical Reviews;2024-01
4. Unconventional direct ink writing of polyelectrolyte films;MRS Bulletin;2023-01-04
5. Leveraging high heating rates to attain desirable reaction products in Al/Zr/C nanocomposites;Materials & Design;2023-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3