The future of solution processing toward organic semiconductor devices: a substrate and integration perspective-Reference-Cited by-同舟云学术

The future of solution processing toward organic semiconductor devices: a substrate and integration perspective

Published:2022 Issue:35 Volume:10 Page:12468-12486
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Wang Shihao¹,Peng Ling¹,Sun Huibin¹^ORCID,Huang Wei¹²³

Affiliation:

1. China Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Jiangsu National Synergistic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, P. R. China

2. Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China

3. Shaanxi Institute of Flexible Electronics (SIFE), Northwestern Polytechnical University (NPU), 127 West Youyi Road, Xi’an 710072, China

Abstract

This review summarizes the solution-processing techniques toward organic semiconductor devices from the perspective of the physical state of the film-forming substrates.

Funder

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2022/TC/D2TC02316D

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3. Halogenated Tetraazapentacenes with Electron Mobility as High as 27.8 cm2 V−1 s−1 in Solution-Processed n-Channel Organic Thin-Film Transistors