High quality interfacial sulfur passivation via H2S pre-deposition annealing for an atomic-layer-deposited HfO2 film on a Ge substrate

Author:

Seok Tae Jun1234,Cho Young Jin56748,Jin Hyun Soo1234,Kim Dae Hyun9234,Kim Dae Woong1234,Lee Sang-Moon101112134,Park Jong-Bong1415674,Won Jung-Yeon1415674,Kim Seong Keun1617184,Hwang Cheol Seong819204,Park Tae Joo12349

Affiliation:

1. Department of Materials Science & Engineering

2. Hanyang University

3. Ansan 15588

4. Korea

5. Inorganic Material Laboratory

6. Samsung Advanced Institute of Technology

7. Suwon 443-803

8. Department of Materials Science & Engineering and Inter-university Semiconductor Research Center

9. Department of Advance Materials Engineering

10. Process Development Team

11. Semiconductor R&D center

12. Samsung Electronics Co. Ltd

13. Hwasung 445-701

14. Analytical Engineering Group

15. Platform Technology Lab.

16. Center for Electronic Materials

17. Korea Institute of Science and Technology

18. Seoul

19. Seoul National University

20. Seoul 151-742

Abstract

The effects of interface sulfur passivation for ALD HfO2/Ge substrate were studied through the (NH4)2S solution treatment and the rapid thermal annealing under an H2S atmosphere.

Funder

National Research Foundation of Korea

Korea Institute of Energy Technology Evaluation and Planning

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Reference29 articles.

1. H. Shang , H.Okorn-Schmidt, K. K.Chan, M.Copel, J.Ott, P.Kozlowski, S.Steen, S.Cordes, H.-S.Wong and E.Jones, IEEE IEDM Tech. Dig., 2002, pp. 441–444

2. Nanoscale germanium MOS Dielectrics-part I: germanium oxynitrides

3. C. Claeys and E.Simoen, Germanium-based technologies: from materials to devices, Elsevier, 2011

4. Oxidation of Ge(100) and Ge(111) surfaces: an UPS and XPS study

5. Electronic properties of (100)Ge/Ge(Hf)O2 interfaces: A first-principles study

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