Transfer printing technologies for soft electronics-Reference-Cited by-同舟云学术

Transfer printing technologies for soft electronics

Published:2022 Issue:45 Volume:14 Page:16749-16760
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Huang Zhenlong¹²³⁴^ORCID,Lin Yuan¹²³^ORCID

Affiliation:

1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China

2. Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen 518110, Guangdong, China

3. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China

4. Research Centre for Information Technology, Shenzhen Institute of Information Technology, Shenzhen 518172, Guangdong, China

Abstract

This article reviews the strategies and applications of transfer printing techniques for soft electronics, including their working mechanisms and demonstrations in nanomaterial assembly, curvy electronics, bioelectronics and 3D integrated electronics.

Funder

University of Electronic Science and Technology of China

Science and Technology Planning Project of Shenzhen Municipality

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2022/NR/D2NR04283E

Reference118 articles.

1. Fully integrated wearable sensor arrays for multiplexed in situ perspiration analysis